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    可靠性测试国际标准

    QRT半导体可靠性试验标准目录如下:

    JEDEC STANDARDS
    Document NumberContent
    JESD22-A100Cycled Temperature-Humidity-Bias Life Test
    JESD22-A101Steady State Temperature Humidity Bias Life Test
    JESD22-A102Accelerated Moisture Resistance - Unbiased Autoclave
    JESD22-A103High Temperature Storage Life
    JESD22-A104Temperature Cycling
    JESD22-A105Power and Temperature Cycling
    JESD22-A106Thermal Shock
    JESD22-A107Salt Atmosphere
    JESD22-A108Temperature, Bias, and Operating Life
    JESD22-A110Highly-Accelerated Temperature and Humidity Stress Test (HAST)
    JESD22-A113Preconditioning of Nonhermetic Surface Mount Devices prior to Reliability Testing
    JESD22-A115Electrostatic Discharge (ESD) Sensitivity Testing Machine Model (MM)
    JESD22-A117ELECTRICALLY ERASABLE PROGRAMMABLE ROM (EEPROM) PROGRAM/ERASE ENDURANCE AND DATA RETENTION TEST
    JESD22-A118Accelerated Moisture Resistance -Unbiased HAST
    JESD22-A119Low Temperature Storage Life
    JESD22-B101External Visual
    JESD22-B102Solderability
    JESD22-B103Vibration, Variable Frequency
    JESD22-B106Resistance to Solder Shock for Through-Hole Mounted Devices
    JESD22-B110Mechanical Shock - Compont and Subassembly
    JESD22-B111Board Level Drop Test Method of Components for Handheld Electronic Products
    JESD22-B113Board Level Cyclic Bend Test Method for Interconnect Reliability Characterization of Components for Handheld Electronic Products
    IPC/JEDEC J-STD-002Solderability Test for Component Leads, Terminations, Lugs, Terminals and Wires
    IPC/JEDEC J-STD-020Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices
    ANSI/ESDA/JEDEC
    JS-001
    Human Body Model (HBM) - Component Level
    ANSI/ESDA/JEDEC
    JS-002
    Charged Device Model (CDM) – Device Level
    JEP122Failure Mechanisms and Models for Semiconductor Devices
    JESD47Stress-Test-Driven Qualification of Integrated Circuits
    JESD74Early Life Failure Rate Calculation Procedure for Semiconductor Components
    JESD78IC Latch-Up Test
    JESD226RF BIASED LIFE (RFBL) TEST METHOD


    AEC STANDARDS
    Document NumberContent
    AEC-Q100Stress Qualification For Integrated Circuits (with test methods)
    AEC-Q101Stress Test Qualification For Discrete Semiconductors
    AEC-Q200Stress Test Qualification For Passive Components (complete document with test methods)
    AEC-Q005Pb-Free Test Requirement
    AEC-Q006Qualification Requirements for Components using Copper Wire Interconnections
    IEC STANDARDS
    Document NumberContent
    IEC 60068Environmental testing
    IEC 60747Semiconductor devices
    IEC 60749Semiconductor devices-Mechanical and climate test methods
    IEC 60810Lamps for road vehicles – Performance requirements




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