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    可靠性测试和不良类型分析/ 可靠性测试相对应的规格,失效分析方法和类型

    Reliability Test MethodStandardFailure ModeFailure Mechanism
    THB
    HAST
    U-HAST
    MSL
    JESD22-A101
    JESD22-A110
    JESD22-A118
    J-STD-020
    Open
    Short
    Leakage
    Functional Failure
    • Aluminum Metal Corrosion

    • Electro Chemical Migration : Dendrite Growth, Conductive Anodic Filament

    • Passivation Damaged

    • Passivation Crack

    • Delamination between layers in die(wafer)

    • Delamination between package(mold compound) and die

    • Delamination between package(mold compound) and internal layer

    • Short by mobile ion caused by contamination or impurities

    • Pad Cratering

    • Whisker

    TC
    PTC
    TS
    PC
    MSL
    JESD22-A104
    JESD22-A105
    JESD22-A106
    JESD22-A113
    J-STD-020
    Open
    Functional Failure
    • Bond Ball Lift

    • Ball Neck Open

    • Stitch Bonding Open

    • Gold Wire Broken

    • Solder Bump Open

    • Passivation Damaged

    • Passivation Crack

    • Delamination between layers in die(wafer)

    • Delamination between package(mold compound) and die

    • Delamination between package(mold compound) and internal layer

    • Pad Cratering

    • Aluminum Slide Failure

    • Whisker

    HTOL
    HTS
    JESD22-A103
    JESD22-A108
    Open
    Leakage
    Functional Failure
    • Bond ball lift by Kirkendall effect

    • Passivation Damage

    • Stress Migration

    • Mobile Ion Charge

    • Charge Loss

    • Aluminum Metal Corrosion

    • Oxide Breakdown

    LTOL
    LTS
    JESD22-A108
    JESD22-A119
    Leakage
    Functional Failure
    • Gate Oxide Breakdown

    BL Drop
    BL TC
    Bending
    JESD22-B111
    IPC9701
    JESD22-B113
    Open
    • Solder Joint Crack

    ESD HBM
    ESD MM
    ESD CDM
    Latch-up
    (Commercial)
    JS-001
    JESD22-A115
    JS-002
    JESD78

    (Automotive)
    AEC-Q100-002
    AEC-Q100-003
    AEC-Q100-011
    AEC-Q100-004
    Open
    Short
    Leakage
    • Contact Spike

    • Gate Oxide Break

    • Poly Melting

    • Metal Melting

    TDDBJP001Leakage
    Functional Failure
    • Gate Oxide Breakdown

    • Oxide Breakdown


    Reliability Test MethodStandardFailure ModeFailure Mechanism
    THB
    HAST
    U-HAST
    MSL
    JESD22-A101
    JESD22-A110
    JESD22-A118
    J-STD-020
    Open
    Short
    Leakage
    Functional Failure
    • Aluminum Metal Corrosion

    • Electro Chemical Migration : Dendrite Growth, Conductive Anodic Filament

    • Passivation Damaged

    • Passivation Crack

    • Delamination between layers in die(wafer)

    • Delamination between package(mold compound) and die

    • Delamination between package(mold compound) and internal layer

    • Short by mobile ion caused by contamination or impurities

    • Pad Cratering

    • Whisker

    TC
    PTC
    TS
    PC
    MSL
    JESD22-A104
    JESD22-A105
    JESD22-A106
    JESD22-A113
    J-STD-020
    Open
    Functional Failure
    • Bond Ball Lift

    • Ball Neck Open

    • Stitch Bonding Open

    • Gold Wire Broken

    • Solder Bump Open

    • Passivation Damaged

    • Passivation Crack

    • Delamination between layers in die(wafer)

    • Delamination between package(mold compound) and die

    • Delamination between package(mold compound) and internal layer

    • Pad Cratering

    • Aluminum Slide Failure

    • Whisker

    HTOL
    HTS
    JESD22-A103
    JESD22-A108
    Open
    Leakage
    Functional Failure
    • Bond ball lift by Kirkendall effect

    • Passivation Damage

    • Stress Migration

    • Mobile Ion Charge

    • Charge Loss

    • Aluminum Metal Corrosion

    • Oxide Breakdown

    LTOL
    LTS
    JESD22-A108
    JESD22-A119
    Leakage
    Functional Failure
    • Gate Oxide Breakdown

    BL Drop
    BL TC
    Bending
    JESD22-B111
    IPC9701
    JESD22-B113
    Open
    • Solder Joint Crack

    ESD HBM
    ESD MM
    ESD CDM
    Latch-up
    (Commercial)
    JS-001
    JESD22-A115
    JS-002
    JESD78

    (Automotive)
    AEC-Q100-002
    AEC-Q100-003
    AEC-Q100-011
    AEC-Q100-004
    Open
    Short
    Leakage
    • Contact Spike

    • Gate Oxide Break

    • Poly Melting

    • Metal Melting

    TDDBJP001Leakage
    Functional Failure
    • Gate Oxide Breakdown

    • Oxide Breakdown



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